发明公开
EP1969677A2 WIRE COMB
审中-公开
- 专利标题： WIRE COMB
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申请号： EP06838904.8申请日： 2006-12-05
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公开(公告)号： EP1969677A2公开(公告)日： 2008-09-17
- 发明人: BROWN, Steven, F. , SEIFERT, Robert, V., Jr. , KIRSHTEIN, Philip, M.
- 申请人： Avocent Corporation
- 申请人地址： 4991 Corporate Drive Huntsville, AL 35805 US
- 专利权人： Avocent Corporation
- 当前专利权人： Avocent Corporation
- 当前专利权人地址： 4991 Corporate Drive Huntsville, AL 35805 US
- 代理机构： Franzolin, Luigi
- 优先权： US295441 20051207; US497317 20060802; US518995 20060912
- 国际公布： WO2007067468 20070614
- 主分类号： H01R12/24
- IPC分类号： H01R12/24
摘要：
An improved approach is provided for mounting individual wires from multi-wire cables onto circuit boards. A wire comb is mounted adjacent one or more ends of the circuit board to permit a rapid yet positive way to space apart individual wires, to hold them in place; and to permit welding or soldering of the wires to the appropriate connections or the circuit board during an overmolding process.
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