Invention Publication
- Patent Title: HONEYCOMB STRUCTURE
- Patent Title (中): 蜂窝结构
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Application No.: EP07739548.1Application Date: 2007-03-23
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Publication No.: EP1997790A1Publication Date: 2008-12-03
- Inventor: IWATA, Koichi , MASUKAWA, Naoshi , WATANABE, Atsushi , ICHIKAWA, Shuichi
- Applicant: NGK Insulators, Ltd.
- Applicant Address: 2-56, Suda-cho, Mizuho-ku Nagoya-shi, Aichi 467-8530 JP
- Assignee: NGK Insulators, Ltd.
- Current Assignee: NGK Insulators, Ltd.
- Current Assignee Address: 2-56, Suda-cho, Mizuho-ku Nagoya-shi, Aichi 467-8530 JP
- Agency: Paget, Hugh Charles Edward
- Priority: JP2006081795 20060323
- International Announcement: WO2007111280 20071004
- Main IPC: C04B37/00
- IPC: C04B37/00 ; B01D39/20 ; B01D46/00 ; F01N3/02
Abstract:
A honeycomb structure 1 comprising a honeycomb segment bonded body 10 having a number of honeycomb segments 2 integrated on each bonding planes via bonding material layers 9 has a structure so that a number of cells 5 providing fluid flow channels are disposed in parallel in the direction of center axis thereof. The honeycomb structure 1 is constructed so that the porosity of an outer portion of the bonding material layers 9 (an area from the interface with the honeycomb segment-bonding plane to a point apart from that interface by a distance equivalent to 20% of the entire layer thickness) is smaller than the porosity of a central portion located inward of the outer portion, and so that the bonding material layers 9 have a compression Young's modulus along the Z-axis of 5 to 100 MPa.
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