发明公开
- 专利标题: HONEYCOMB STRUCTURE
- 专利标题(中): 蜂窝结构
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申请号: EP07739548.1申请日: 2007-03-23
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公开(公告)号: EP1997790A1公开(公告)日: 2008-12-03
- 发明人: IWATA, Koichi , MASUKAWA, Naoshi , WATANABE, Atsushi , ICHIKAWA, Shuichi
- 申请人: NGK Insulators, Ltd.
- 申请人地址: 2-56, Suda-cho, Mizuho-ku Nagoya-shi, Aichi 467-8530 JP
- 专利权人: NGK Insulators, Ltd.
- 当前专利权人: NGK Insulators, Ltd.
- 当前专利权人地址: 2-56, Suda-cho, Mizuho-ku Nagoya-shi, Aichi 467-8530 JP
- 代理机构: Paget, Hugh Charles Edward
- 优先权: JP2006081795 20060323
- 国际公布: WO2007111280 20071004
- 主分类号: C04B37/00
- IPC分类号: C04B37/00 ; B01D39/20 ; B01D46/00 ; F01N3/02
摘要:
A honeycomb structure 1 comprising a honeycomb segment bonded body 10 having a number of honeycomb segments 2 integrated on each bonding planes via bonding material layers 9 has a structure so that a number of cells 5 providing fluid flow channels are disposed in parallel in the direction of center axis thereof. The honeycomb structure 1 is constructed so that the porosity of an outer portion of the bonding material layers 9 (an area from the interface with the honeycomb segment-bonding plane to a point apart from that interface by a distance equivalent to 20% of the entire layer thickness) is smaller than the porosity of a central portion located inward of the outer portion, and so that the bonding material layers 9 have a compression Young's modulus along the Z-axis of 5 to 100 MPa.
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