发明授权
- 专利标题: BONDED BODY
- 专利标题(中): 受保护的身体
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申请号: EP07739547.3申请日: 2007-03-23
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公开(公告)号: EP2006265B1公开(公告)日: 2018-01-03
- 发明人: TOMITA, Takahiro , MORIMOTO, Kenji
- 申请人: NGK Insulators, Ltd.
- 申请人地址: 2-56, Suda-cho, Mizuho-ku Nagoya-shi, Aichi 467-8530 JP
- 专利权人: NGK Insulators, Ltd.
- 当前专利权人: NGK Insulators, Ltd.
- 当前专利权人地址: 2-56, Suda-cho, Mizuho-ku Nagoya-shi, Aichi 467-8530 JP
- 代理机构: Naylor, Matthew John
- 优先权: JP2006082103 20060324
- 国际公布: WO2007111279 20071004
- 主分类号: C04B37/00
- IPC分类号: C04B37/00 ; B01D39/20 ; B01D46/00 ; F01N3/02
摘要:
There is provided a bonding material composition capable of suppressing crack generation on an end face of a resultant honeycomb structure to a large extent by reducing anisotropy of Young's modulus after curing of the bonding material by the use of an isotropic filler without using inorganic fibers. The bonded body has two or more members unitarily bonded by means of a bonding material layer, and the relational expression of 0.5
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