发明公开
EP2006929A2 Thin-film transistor device and manufacturing method
审中-公开
Dünnschichttransistorvorrichtungund Herstellungsverfahrendafür
- 专利标题: Thin-film transistor device and manufacturing method
- 专利标题(中): Dünnschichttransistorvorrichtungund Herstellungsverfahrendafür
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申请号: EP08010391.4申请日: 2008-06-06
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公开(公告)号: EP2006929A2公开(公告)日: 2008-12-24
- 发明人: Shiba, Takeo , Hashizume, Tomihiro , Suwa, Yuji , Arai, Tadashi
- 申请人: Hitachi Ltd.
- 申请人地址: 6-6, Marunouchi 1-chome Chiyoda-ku Tokyo 100-8280 JP
- 专利权人: Hitachi Ltd.
- 当前专利权人: Hitachi Ltd.
- 当前专利权人地址: 6-6, Marunouchi 1-chome Chiyoda-ku Tokyo 100-8280 JP
- 代理机构: Strehl Schübel-Hopf & Partner
- 优先权: JP2007160621 20070618
- 主分类号: H01L51/00
- IPC分类号: H01L51/00 ; H01L27/28
摘要:
The present invention provides a method of manufacturing a thin-film transistor device. This method enables improvement in performance of a complementary TFT circuit incorporated in a thin-and light-weighted image display device or a flexible electronic device and also enables reduction of power consumption and reduction of manufacturing cost of the circuit. Further in the method, the number of manufacturing steps is decreased so that mass production and growth in size of thin film transistor devices are facilitated through a printing technique. In this method, electrodes forming n-type and p-type TFT and an organic semiconductor are made of the same material in both types of TFT by the solution-process and/or printable process method. A first polarizable thin-film 7 is formed on an interface between a gate insulator and a semiconductor, and also a second polarizable thin film 8 provided on an interface between source and drain electrodes 5 and a semiconductor film 9. A complementary thin-film transistor device is manufactured by selectively exposing either the n-type TFT area or the p-type TFT area to light to remove the polarizing function from the first and second polarizable thin films in the area.
公开/授权文献
- EP2006929A3 Thin-film transistor device and manufacturing method 公开/授权日:2011-05-18
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