There is disclosed a bonded element manufactured from a bonding material composition being capable of contributing to the lowering of thermal expansion of a bonding material layer sufficiently to relax any thermal stress generated in a honeycomb structure and largely inhibiting the cracking of the resultant honeycomb structure as well. In a bonded element in which two or more objects to be bonded are integrated via a bonding material layer, the bonding material layer having a Young's modulus of 20% or less of that of the objects to be bonded and having an average linear thermal expansion coefficient of 70% or less of that of the objects to be bonded, the bonding material layer being prepared from a bonding material composition composed mainly of fillers and a matrix in which fillers having an average linear thermal expansion coefficient of 2.0×10 -6 •K -1 or less are contained.