发明公开
EP2045839A1 ADHESIVE FOR ELECTRONIC COMPONENTS, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP LAMINATE, AND SEMICONDUCTOR DEVICE
审中-公开
胶电子元器件，一种用于生产半导体芯片层叠和半导体器件
- 专利标题： ADHESIVE FOR ELECTRONIC COMPONENTS, METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP LAMINATE, AND SEMICONDUCTOR DEVICE
- 专利标题（中）： 胶电子元器件，一种用于生产半导体芯片层叠和半导体器件
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申请号： EP07791028.9申请日： 2007-07-19
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公开(公告)号： EP2045839A1公开(公告)日： 2009-04-08
- 发明人: ISHIZAWA, Hideaki , HAYAKAWA, Akinobu
- 申请人： Sekisui Chemical Co., Ltd.
- 申请人地址： 4-4, Nishitemma 2-chome, Kita-ku Osaka-shi Osaka 530-8565 JP
- 专利权人： Sekisui Chemical Co., Ltd.
- 当前专利权人： Sekisui Chemical Co., Ltd.
- 当前专利权人地址： 4-4, Nishitemma 2-chome, Kita-ku Osaka-shi Osaka 530-8565 JP
- 代理机构： Hart-Davis, Jason
- 优先权： JP2006198311 20060720; JP2007002803 20070110; JP2007005092 20070112
- 国际公布： WO2008010555 20080124
- 主分类号： H01L21/52
- IPC分类号： H01L21/52 ; C09J11/04 ; C09J163/00 ; H01L25/065 ; H01L25/07 ; H01L25/18
摘要：
It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts.
The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25°C by using an E type viscometer, and a viscosity at 0.5 rpm being 1.4 to 3 times as large as the viscosity at 1 rpm, and the viscosity at 1 rpm being 2 to 5 times as large as the viscosity at 10 rpm.
The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25°C by using an E type viscometer, and a viscosity at 0.5 rpm being 1.4 to 3 times as large as the viscosity at 1 rpm, and the viscosity at 1 rpm being 2 to 5 times as large as the viscosity at 10 rpm.
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