发明公开
EP2055419A1 Method of soldering a magnesium alloy workpiece with electroless plating with Nickel-Phosphrous, fluxing and use of a leadfree tin alloy solder
审中-公开
一种用于使用镍 - 磷，一个Flüssimittels和自由铅 - 锡合金焊接材料的化学镀焊接由镁合金制成的工件的方法
- 专利标题： Method of soldering a magnesium alloy workpiece with electroless plating with Nickel-Phosphrous, fluxing and use of a leadfree tin alloy solder
- 专利标题（中）： 一种用于使用镍 - 磷，一个Flüssimittels和自由铅 - 锡合金焊接材料的化学镀焊接由镁合金制成的工件的方法
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申请号： EP08251752.5申请日： 2008-05-20
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公开(公告)号： EP2055419A1公开(公告)日： 2009-05-06
- 发明人: Ho, Climent
- 申请人： Magtech Technology Co., Ltd
- 申请人地址： No. 78, Chengtian Road Tucheng City Taipei Hsi 236 TW
- 专利权人： Magtech Technology Co., Ltd
- 当前专利权人： Magtech Technology Co., Ltd
- 当前专利权人地址： No. 78, Chengtian Road Tucheng City Taipei Hsi 236 TW
- 代理机构： Gee, Steven William
- 优先权： TW96141635 20071105
- 主分类号： B23K1/00
- IPC分类号： B23K1/00 ; B23K1/19 ; B23K1/20 ; B23K35/26 ; B23K35/36 ; C23C18/32 ; C23C18/50 ; C23C18/54
摘要：
The present application relates to a method of soldering a magnesium alloy workpiece. The method includes providing a magnesium alloy workpiece; modifying a surface of the magnesium alloy workpiece; performing a high phosphorous (7 to 12 wt% of P) electroless nickel plating process on the surface of the magnesium alloy workpiece; preparing a solder flux for different lead-free tin alloy solder; and performing a tin soldering process to solder the magnesium alloy workpiece with the lead-free tin alloy solder containing its corresponding solder flux.
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