A method for manufacturing a ceramic substrate having a via hole and a surface wiring pattern to which the via hole is electrically connected. The method comprises a step of preparing a sintered ceramic substrate having a via hole, a step of forming a sintered ceramic layer having a hole or an opening portion whose bottom is constituted of at least part of the exposed end surface of the via hole on the sintered ceramic substrate by the post-fire method, a step of forming a conductive portion electrically connecting the surface of the sintered ceramic layer and the via hole in the hole or opening portion, and a step of forming a surface wiring pattern electrically connecting to the conductive portion on the surface of the sintered ceramic layer. With this, even if a sintered ceramic substrate is manufactured by the co-fire method, the position of the connection between the via hole and the surface wiring pattern can be controlled with high precision, any problem such as short-circuit is not caused, and a fine wiring pattern with high precision can be formed on a ceramic substrate.