The present invention forms a conductive pattern using a simple process on a general plastic substrate having flexibility, and also provides a conductive pattern forming film that allows for easy formation of a conductive pattern using an apparatus that performs a simple process of oriented pressurization at low temperature, as well as a method for forming conductive pattern and a conductive pattern forming apparatus for the same.
The conductive pattern forming film provides a pattern formed on a film substrate having flexibility by pressurizing, under heating, a conductive paste in which powder or fine particles of metal or semiconductor are dispersed and filled. The conductive pattern forming apparatus comprises a sample installation table having a flat placement surface, and a driving body for pressure application which is placed in a manner facing the placement surface and movable, wherein the driving body for pressure application is equipped with a support which is constituted by a flat metal panel having metal spheres along its bottom face.