发明授权
- 专利标题: BLISTER PACK SECONDARY PACKAGE
- 专利标题(中): 包装泡罩
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申请号: EP07865111.4申请日: 2007-12-03
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公开(公告)号: EP2091842B1公开(公告)日: 2011-03-23
- 发明人: JONES, Marty
- 申请人: MeadWestvaco Corporation
- 申请人地址: 501 South 5th Street Richmond, VA 23219-0501 US
- 专利权人: MeadWestvaco Corporation
- 当前专利权人: MeadWestvaco Corporation
- 当前专利权人地址: 501 South 5th Street Richmond, VA 23219-0501 US
- 代理机构: Coulson, Elizabeth Eve
- 优先权: US869004P 20061207
- 国际公布: WO2008070622 20080612
- 主分类号: B65D83/04
- IPC分类号: B65D83/04
摘要:
A blank (10) for forming a secondary package without a heat-seal process is disclosed. The secondary package can be an inner slide card configured to receive one or more blister packs (51). A pocket opening (30) can be formed in one panel (14) of the blank (10). Receiving portions (44) can be formed on one or more panels. A blister pack (51) can be inserted into the secondary package through the pocket opening (30). The receiving portions (44) can mechanically interact with edges (56) of a blister pack (51) to retain the blister pack (51) in a desired position. The exit regions of an inserted blister pack (51) can be aligned with gates (40) formed in a panel ( 12) of the secondary package. When the blister pack (51 ) is in the proper orientation relative to the secondary package, the blister pack (51) can be locked in place mechanically, glued in place, or both.
公开/授权文献
- EP2091842A1 BLISTER PACK SECONDARY PACKAGE 公开/授权日:2009-08-26
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