An apparatus for precipitating/separating excess copper which has dissolved in a lead-free solder comprising tin as the main ingredient. With the apparatus, the tin is safely and efficiently recovered. The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper. It has a constitution comprising: a precipitation tank (2) in which a lead-free solder containing copper dissolving therein is kept in a molten state and an intermetallic compound among a metal added externally, the copper contained in the molten solder, and the tin contained in the molten solder is precipitated while maintaining the molten state; a granulation tank (4) which has perforated plates (31), (32), and (33) and in which the molten lead-free solder is passed through the perforated plates to thereby bond particles of the intermetallic compound to one another and increase the particle diameter thereof; and a separation tank (5) in which the enlarged intermetallic compound particles are sedimented in the molten lead-free solder and separated.