A method for manufacturing a translucent panel for connecting electronic components consisting of a first step of deposition, on a translucent substrate, of a base electroconducting translucent layer, followed by a sequence of steps with the alternating depositions of isolating layers and conducting layers. A translucent panel for connecting electronic components comprising a translucent glass substrate coated with a base electroconducting layer, and on top thereof a stack of translucent layers with alternating translucent isolating layers and layers comprising conducting translucent zones. Use of the panel to build an electronic translucent circuit comprising electronic components.