发明公开
- 专利标题： ELEKTRISCHE KONTAKTANORDNUNG FÜR DIE TELEKOMMUNIKATIONS- UND DATENTECHNIK
- 专利标题（英）： Electrical contact arrangement for telecommunications and data systems technology
- 专利标题（中）： 电接触装置为电信和数据技术
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申请号： EP07856678.3申请日： 2007-12-13
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公开(公告)号： EP2127037A2公开(公告)日： 2009-12-02
- 发明人: HETZER, Ulrich , MÖSSNER, Frank
- 申请人： ADC GmbH
- 申请人地址： Beeskowdamm 3-11 14167 Berlin DE
- 专利权人： ADC GmbH
- 当前专利权人： ADC GmbH
- 当前专利权人地址： Beeskowdamm 3-11 14167 Berlin DE
- 优先权： DE102007002768 20070118
- 国际公布： WO2008086864 20080724
- 主分类号： H01R13/24
- IPC分类号： H01R13/24 ; H01R24/04
摘要：
The invention relates to an electrical contact arrangement (1) for telecommunications and data systems technology, comprising at least one electrical contact (K1) and a printed circuit board (2), the contact (K1) being connected to the printed circuit board (2) both electrically and mechanically. The contact (K1) comprises a contact region (7) on which an electrical contact for contacting the counter-contact is generated. The distance (L el) between the contact region (7) of the contact (K1, K8) and the electrical contact point (K8) for contacting the printed circuit board (2) is shorter than the distance (L mech) between the contact region (7) of the contact (K1, K8) and the mechanical contact point (9) for contacting the printed circuit board (2).
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