The invention relates to a method of producing an electronic connection device (100), comprising: a) the formation, in the plane of a support substrate (2), of at least one first contact element (10, 34) and, in a direction approximately perpendicular to said plane, of at least one second contact element (4, 36) having a first end in electrical contact with the first contact element or elements and a second end, the second contact element or elements having one or more metal tracks (36) standing up along said direction perpendicular to the surface of the substrate; b) then the positioning of at least one electrical or electronic component (22) in contact with the first contact element or elements (10, 34); and c) the encapsulation of the component(s) and of the first and second contact elements, at least the second end or ends of the second contact element or elements (4, 36) being flush with the surface (27) of the encapsulating material.