发明公开
- 专利标题: Improved seal integrity for mailpiece envelopes
- 专利标题(中): 邮件信封,提高密封完整性
-
申请号: EP09169820.9申请日: 2009-09-09
-
公开(公告)号: EP2177370A3公开(公告)日: 2010-07-14
- 发明人: Reichelsheimer, Jay , Kline, John , Cordery, Robert A.
- 申请人: Pitney Bowes, Inc.
- 申请人地址: One Elmcroft Road Stamford, CT 06926-0700 US
- 专利权人: Pitney Bowes, Inc.
- 当前专利权人: Pitney Bowes, Inc.
- 当前专利权人地址: One Elmcroft Road Stamford, CT 06926-0700 US
- 代理机构: HOFFMANN EITLE
- 优先权: US251515 20081015
- 主分类号: B43M5/04
- IPC分类号: B43M5/04 ; C09J1/00 ; C09J5/04 ; G01N21/75
摘要:
A method, system and article for producing an envelope having improved seal integrity. The method includes the steps of: disposing (A) at least one material at the interface of the adhesive seal between the flap and the body portion of the envelope, which material radiates thermal energy when combined with an activating agent. The envelope is then sealed by closing (B1 the flap onto the body portion of the envelope and combining (B2) the material with the activating agent at the sealing interface so as to change the thermal energy radiated therefrom. The seal is then inspected (C) to determine whether the thermal energy radiated from the activated material has changed thereby confirming that a seal has been produced between the flap and body portion of the envelope. The system and article are directed to the various modules of a mailpiece fabrication system employed to produce the mailpiece including an inspection module for confirming that a seal has been formed.
公开/授权文献
- EP2177370A2 Improved seal integrity for mailpiece envelopes 公开/授权日:2010-04-21
信息查询