发明授权
- 专利标题： DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS
- 专利标题（中）： 直喷式强制对流FOR ELECTRONICS
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申请号： EP08804643.8申请日： 2008-09-24
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公开(公告)号： EP2193701B1公开(公告)日： 2011-06-08
- 发明人: BROK, Gerrit Johannes Hendrikus Maria , WITS, Wessel Willems , MANNAK, Jan Hendrik , LEGTENBERG, Rob
- 申请人： Thales Nederland B.V.
- 申请人地址： Zuidelijke Havenweg 40 7550 GD Hengelo NL
- 专利权人： Thales Nederland B.V.
- 当前专利权人： Thales Nederland B.V.
- 当前专利权人地址： Zuidelijke Havenweg 40 7550 GD Hengelo NL
- 代理机构： Lucas, Laurent Jacques
- 优先权： NL1034420 20070924
- 国际公布： WO2009040366 20090402
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01L23/46
摘要：
Electronic circuitry comprises a circuit board (34) and at least one component (30,32) mounted on the circuit board (34), wherein the at least one component (30,32) generates heat in use, the circuit board (34) includes at least one aperture (48, 50) aligned with the component (30,32) or a respective one of the components, and the electronic circuitry is configured to provide, in use, a path for coolant fluid to flow through the or each aperture (48, 50) and past the at least one component (30,32).
公开/授权文献
- EP2193701A1 DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS 公开/授权日：2010-06-09
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