发明公开
- 专利标题: COMPONENT ASSEMBLY AND ALIGNMENT
- 专利标题(中): 组件安装位置和方向
-
申请号: EP08834641.6申请日: 2008-09-26
-
公开(公告)号: EP2198453A2公开(公告)日: 2010-06-23
- 发明人: ELDRIDGE, Benjamin, N. , HOBBS, Eric D. , MATHIEU, Gaetan, L.
- 申请人: FormFactor, Inc.
- 申请人地址: 7005 Southfront Road Livermore, CA 94551 US
- 专利权人: FormFactor, Inc.
- 当前专利权人: FormFactor, Inc.
- 当前专利权人地址: 7005 Southfront Road Livermore, CA 94551 US
- 代理机构: Harris, Ian Richard
- 优先权: US861559 20070926
- 国际公布: WO2009042940 20090402
- 主分类号: H01L21/66
- IPC分类号: H01L21/66 ; H01L21/68
摘要:
A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the first structure is in a position with respect to the second structure that aligns first features on the first structure with second features on the second structures. The second feature can be in a second plane that is generally parallel to the first plane. The first and second structures can be first and second electronic components, which can be components of a probe card assembly.
信息查询
IPC分类: