发明公开
- 专利标题: LOW PROFILE INTERVERTEBRAL IMPLANT
- 专利标题(中): 低剖面椎间植入物
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申请号: EP08849046.1申请日: 2008-11-05
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公开(公告)号: EP2217179A1公开(公告)日: 2010-08-18
- 发明人: KUEENZI, Thomas , WALSH, Ryan , PEPE, Tom , HUNZIKER, Markus , KOCH, David
- 申请人: Synthes GmbH
- 申请人地址: Eimattstrasse 3 4436 Oberdorf CH
- 专利权人: Synthes GmbH
- 当前专利权人: Synthes GmbH
- 当前专利权人地址: Eimattstrasse 3 4436 Oberdorf CH
- 代理机构: Lusuardi, Werther
- 优先权: US988661P 20071116
- 国际公布: WO2009064644 20090522
- 主分类号: A61F2/44
- IPC分类号: A61F2/44
摘要:
The present invention is directed to a low profile intervertebral implant (10) for implantation in an intervertebral disc space (D) in-between adjacent vertebral bodies (V). The intervertebral implant includes a plate (40) preferably coupled to a spacer (20). The plate is preferably formed from a first material and the spacer is preferably formed from a second material, the first material being different from the second material. The plate is preferably sized and configured so that the plate does not extend beyond the perimeter of the spacer. In this manner, the plate preferably does not increase the height profile (hs) of the spacer and the plate may be implanted within the intervertebral disc space in conjunction with the spacer.
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