发明公开
EP2224490A1 CONTROL SUBSTRATE AND CONTROL SUBSTRATE MANUFACTURING METHOD
审中-公开
STEUERSUBSTRAT UND STEUERSUBSTRAT-HERSTELLUNGSVERFAHREN
- 专利标题： CONTROL SUBSTRATE AND CONTROL SUBSTRATE MANUFACTURING METHOD
- 专利标题（中）： STEUERSUBSTRAT UND STEUERSUBSTRAT-HERSTELLUNGSVERFAHREN
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申请号： EP08855870.5申请日： 2008-12-05
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公开(公告)号： EP2224490A1公开(公告)日： 2010-09-01
- 发明人: NISHIOKA, Yukiya , MATSUMURO, Tomonori , KASAHARA, Kenji
- 申请人： Sumitomo Chemical Company, Limited
- 申请人地址： 27-1, Shinkawa 2-chome Chuo-ku Tokyo 104-8260 JP
- 专利权人： Sumitomo Chemical Company, Limited
- 当前专利权人： Sumitomo Chemical Company, Limited
- 当前专利权人地址： 27-1, Shinkawa 2-chome Chuo-ku Tokyo 104-8260 JP
- 代理机构： Jackson, Martin Peter
- 优先权： JP2007316771 20071207
- 国际公布： WO2009072675 20090611
- 主分类号： H01L29/786
- IPC分类号： H01L29/786 ; G02F1/1368 ; H01L51/50
摘要：
A control substrate comprising:
a substrate main body;
a base layer provided on one surface perpendicular to a thickness direction of the substrate main body; and
a switching element provided on the base layer's surface located on the opposite side to the substrate main body ,so as to perform switching between an electric connection and an electric disconnection,
wherein the switching element comprises an electrode formed on the surface of the base layer by an application method,the surface being opposite to the substrate main body , and
the base layer is formed of a member whose adhesiveness to the electrode is higher than the adhesiveness of the substrate main body to an electrode when forming the electrode on a base layer side surface of the substrate main body by an application method.
a substrate main body;
a base layer provided on one surface perpendicular to a thickness direction of the substrate main body; and
a switching element provided on the base layer's surface located on the opposite side to the substrate main body ,so as to perform switching between an electric connection and an electric disconnection,
wherein the switching element comprises an electrode formed on the surface of the base layer by an application method,the surface being opposite to the substrate main body , and
the base layer is formed of a member whose adhesiveness to the electrode is higher than the adhesiveness of the substrate main body to an electrode when forming the electrode on a base layer side surface of the substrate main body by an application method.
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