发明公开
EP2259135A2 Semiconductor Device and Manufacturing Method Thereof
审中-公开
Halbleiterbauelement和dessen Herstellungsverfahren
- 专利标题: Semiconductor Device and Manufacturing Method Thereof
- 专利标题(中): Halbleiterbauelement和dessen Herstellungsverfahren
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申请号: EP10176397.7申请日: 2000-05-15
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公开(公告)号: EP2259135A2公开(公告)日: 2010-12-08
- 发明人: Murakami, Satoshi , Hirakata, Yoshiharu , Fujimoto, Etsuko , Yamazaki, Yu , Yamazaki, Shunpei
- 申请人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 申请人地址: 398, Hase Atsugi-shi, Kanagawa 243-0036 JP
- 专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- 当前专利权人地址: 398, Hase Atsugi-shi, Kanagawa 243-0036 JP
- 代理机构: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät
- 优先权: JP13499299 19990514
- 主分类号: G02F1/1362
- IPC分类号: G02F1/1362 ; G02F1/161 ; H01L27/12
摘要:
A semiconductor device comprising a thin film transistor formed on an insulator, said thin film transistor comprising at least a source region, a drain region, a channel forming region, and a gate electrode with a gate insulating film interposed therebetween; and a pixel comprising a pixel electrode connected with said source or said drain region and comprising a storage capacitor, wherein said storage capacitor is formed of a shielding film provided over said thin film transistor with an insulating film interposed therebetween, an insulating layer covering said shielding film, and said pixel electrode provided in contact with said insulating layer, and wherein said insulating layer has a hole which is filled with an insulating material comprising a resin material.
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