发明公开
- 专利标题: DIE ASSEMBLY AND MOLDING METHOD
- 专利标题(中): DÜSENANORDNUNGUND FORGGEBUNGSVERFAHREN
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申请号: EP09727563.0申请日: 2009-03-24
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公开(公告)号: EP2272807A1公开(公告)日: 2011-01-12
- 发明人: UENO, Tomoyuki , HASEGAWA, Masato , TERAOKA, Kanji
- 申请人: Sumitomo Electric Industries, Ltd.
- 申请人地址: 5-33 Kitahama 4-chome Chuo-ku Osaka-shi Osaka 541-0041 JP
- 专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人: Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: 5-33 Kitahama 4-chome Chuo-ku Osaka-shi Osaka 541-0041 JP
- 代理机构: Setna, Rohan P.
- 优先权: JP2008090666 20080331
- 国际公布: WO2009122965 20091008
- 主分类号: C03B11/06
- IPC分类号: C03B11/06 ; C03B11/00 ; B29C33/38
摘要:
A die assembly includes a barrel die (4) having a tubular inner face, a sleeve (5) covering an outer peripheral surface of the barrel die, and a pair of core dies (1, 2) for pressing a preform inside the tubular inner surface of the barrel die. At least one of the paired core dies (1, 2) is slidable and guided along the tubular inner surface of the barrel die (4). The sleeve (5) does not transmit light having a wavelength of 5 µm or shorter and has a thermal conductivity of 70 W/m·K or greater.
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