Invention Publication
- Patent Title: A backlit key assembly having a reduced thickness
- Patent Title (中): 对于具有单件式键帽的便携式电子设备键排列
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Application No.: EP11156716.0Application Date: 2009-09-28
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Publication No.: EP2323151A1Publication Date: 2011-05-18
- Inventor: Chen, Chao , Papke, Jana Lynn , Wennemer, Dietmar Frank
- Applicant: Research in Motion Limited
- Applicant Address: 295 Phillip Street Waterloo, Ontario N2L 3W8 CA
- Assignee: Research in Motion Limited
- Current Assignee: Research in Motion Limited
- Current Assignee Address: 295 Phillip Street Waterloo, Ontario N2L 3W8 CA
- Agency: Patel, Binesh
- Priority: EP09153733 20090226
- Main IPC: H01H13/83
- IPC: H01H13/83 ; H01H13/705
Abstract:
A backlit key assembly (102) having a reduced thickness for an electronic device, and an electronic device having such a backlit key assembly are provided. The key assembly utilizes a local recess (160) in a backing plate (152) of the key assembly to lower the light source (e.g. LED (142)) and flexible printed circuit board (140) relative to the backing plate. The key assembly described herein provides a suitable leading space for the light source while permitting the overall thickness of the key assembly to be reduced compared with conventional backlit key designs.
Public/Granted literature
- EP2323151B1 A backlit key assembly having a reduced thickness Public/Granted day:2014-04-09
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