Invention Publication
EP2323151A1 A backlit key assembly having a reduced thickness 有权
对于具有单件式键帽的便携式电子设备键排列

A backlit key assembly having a reduced thickness
Abstract:
A backlit key assembly (102) having a reduced thickness for an electronic device, and an electronic device having such a backlit key assembly are provided. The key assembly utilizes a local recess (160) in a backing plate (152) of the key assembly to lower the light source (e.g. LED (142)) and flexible printed circuit board (140) relative to the backing plate. The key assembly described herein provides a suitable leading space for the light source while permitting the overall thickness of the key assembly to be reduced compared with conventional backlit key designs.
Public/Granted literature
Information query
Patent Agency Ranking
0/0