发明公开
- 专利标题： Leveler Compounds
- 专利标题（中）： Nivellierverbindungen
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申请号： EP10197474.9申请日： 2005-07-16
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公开(公告)号： EP2327814A1公开(公告)日： 2011-06-01
- 发明人: Wang, Deyan , Mikkola, Robert D , Wu, Chunyi , Barclay, George G
- 申请人： Rohm and Haas Electronic Materials LLC
- 申请人地址： 455 Forest Street Marlborough, MA 01752 US
- 专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人： Rohm and Haas Electronic Materials LLC
- 当前专利权人地址： 455 Forest Street Marlborough, MA 01752 US
- 代理机构： Buckley, Guy Julian
- 优先权： US590396P 20040722
- 主分类号： C25D3/38
- IPC分类号： C25D3/38 ; C08G59/00
摘要：
A reaction product of a compound comprising a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage. Preferably, the compound comprising a heteroatom is imidazole and the polyepoxide compound has the formula (I)
wherein R is (C1-C10)alkyl; and R 2 and R 3 are independently chosen from H and R, wherein n = 1-20.
wherein R is (C1-C10)alkyl; and R 2 and R 3 are independently chosen from H and R, wherein n = 1-20.
公开/授权文献
- EP2327814B1 Leveler Compounds 公开/授权日：2013-03-20
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