发明公开
EP2360218A4 BONDING METHOD, BONDED STRUCTURE, METHOD FOR PRODUCING OPTICAL MODULE, AND OPTICAL MODULE
审中-公开
接合方法中,接合结构,方法用于生产光模块和光模块
- 专利标题: BONDING METHOD, BONDED STRUCTURE, METHOD FOR PRODUCING OPTICAL MODULE, AND OPTICAL MODULE
- 专利标题(中): 接合方法中,接合结构,方法用于生产光模块和光模块
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申请号: EP09820586申请日: 2009-10-14
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公开(公告)号: EP2360218A4公开(公告)日: 2012-07-04
- 发明人: USHIRO YUKI , KAMEDA TAKAMASA , KOMAI KAZUNARI , MIYATA TSUYOSHI , OKUNO MOTOHARU , KASUYA MAKOTO
- 申请人: OMRON TATEISI ELECTRONICS CO
- 专利权人: OMRON TATEISI ELECTRONICS CO
- 当前专利权人: OMRON TATEISI ELECTRONICS CO
- 优先权: JP2008267736 2008-10-16
- 主分类号: C09J5/00
- IPC分类号: C09J5/00 ; B32B7/00 ; B32B7/02 ; B32B7/04 ; B32B7/12 ; G02B6/122 ; G02B6/42 ; H01L23/29 ; H01L23/31 ; H01L31/02 ; H01L33/00
摘要:
A first light-blocking member (10) and a second light-blocking member (30) are adhered to each other by forming a light-transmitting layer having a light-transmitting composition (21) serving as a base material and a light-transmitting filler (22) different in index of refraction from this light-transmitting composition (21) on a front surface of the first light-blocking member (10), applying a liquid light curing adhesive to a front surface (20a) of the light-transmitting layer (20), arranging the second light-blocking member (30) on the front surface (20a) of the light-transmitting layer (20) to which the liquid light curing adhesive has been applied, curing the liquid light curing adhesive by irradiating the light-transmitting layer (20) with light having a prescribed wavelength laterally from a side of the light-transmitting layer (20) so as to adhere the light-transmitting layer (20) and the second light-blocking member (30) to each other. By doing so, in adhering the light-blocking members to each other by using a light curing adhesive, an adhesion operation can easily and quickly be performed while ensuring sufficient adhesion strength.
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