发明公开
- 专利标题: Selegiline-containing adhesive preparation
- 专利标题(中): Seleginhaltige胶粘剂生产
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申请号: EP11157780.5申请日: 2011-03-11
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公开(公告)号: EP2364733A3公开(公告)日: 2012-04-04
- 发明人: Inosaka, Keigo , Ameyama, Satoshi , Nakamura, Koji , Sekiya, Junichi
- 申请人: Nitto Denko Corporation , Fujimoto Co., Ltd.
- 申请人地址: 1-1-2, Shimohozumi Ibaraki-shi, Osaka 567-8680 JP
- 专利权人: Nitto Denko Corporation,Fujimoto Co., Ltd.
- 当前专利权人: Nitto Denko Corporation,Fujimoto Co., Ltd.
- 当前专利权人地址: 1-1-2, Shimohozumi Ibaraki-shi, Osaka 567-8680 JP
- 代理机构: Grünecker, Kinkeldey, Stockmair & Schwanhäusser
- 优先权: JP2010056631 20100312
- 主分类号: A61K9/70
- IPC分类号: A61K9/70 ; A61K47/02 ; A61K47/10 ; A61K47/22 ; A61K31/137
摘要:
The present invention provides an adhesive preparation, which includes a backing and a pressure-sensitive adhesive layer formed on at least one side of the backing, the pressure-sensitive adhesive layer containing (-)-(R)-N,α-dimethyl-N-2-propynylphenethylamine and/or a pharmaceutically acceptable salt thereof, a pressure-sensitive adhesive and one or two or more stabilizers selected from the group consisting of 2-mercaptobenzimidazole, sodium sulfite, butylhydroxyanisole and butylhydroxytoluene.
公开/授权文献
- EP2364733A2 Selegiline-Containing Adhesive Preparation 公开/授权日:2011-09-14
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