- 专利标题： EPOXY RESIN COMPOSITION, PREPREG, LAMINATE BOARD AND MULTILAYER BOARD
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申请号： EP09833468.3申请日： 2009-12-17
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公开(公告)号： EP2368929B1公开(公告)日： 2018-10-31
- 发明人: NISHINO, Mitsuyoshi , SATOU, Fuminori , FUJINO, Kentaro , NAKAMURA, Yoshihiko
- 申请人： Panasonic Intellectual Property Management Co., Ltd.
- 申请人地址： 7 OBP Panasonic Tower, 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 540-6207 JP
- 专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人： Panasonic Intellectual Property Management Co., Ltd.
- 当前专利权人地址： 7 OBP Panasonic Tower, 1-61, Shiromi 2-chome, Chuo-ku, Osaka-shi, Osaka 540-6207 JP
- 代理机构： Appelt, Christian W.
- 优先权： JP2008324651 20081219
- 国际公布： WO2010071165 20100624
- 主分类号： C08G59/30
- IPC分类号： C08G59/30 ; C08J5/24 ; C08K3/00 ; C08K5/5435 ; C08K5/5465 ; C08L63/00 ; C08G59/32 ; C08G59/62 ; C08K5/54
摘要：
The present invention provides an epoxy resin composition having a high heat resistance such as a thermal decomposition temperature, as well as a high adhesive strength, in particular inner layer adhesive strength, and also provides a prepreg, a laminate board and a multi-layer board using the composition. The epoxy resin composition according to the present invention contains an epoxy resin containing nitrogen and bromine in the molecule, a curing agent having a phenolic hydroxyl group, and a silane compound having no cure acceleration action and having reactivity with the epoxy resin. The bromine content in a resin component of the epoxy resin composition is 10 mass% or greater.
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