发明公开
EP2373135A1 Printed Circuit Board and Method of Fabricating Printed Circuit Board
审中-公开
Gedruckte Leiterplatte und Verfahren zur Herstellung einer gedruckten Leiterplatte
- 专利标题： Printed Circuit Board and Method of Fabricating Printed Circuit Board
- 专利标题（中）： Gedruckte Leiterplatte und Verfahren zur Herstellung einer gedruckten Leiterplatte
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申请号： EP11158025.4申请日： 2011-03-14
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公开(公告)号： EP2373135A1公开(公告)日： 2011-10-05
- 发明人: Nakamura, Naoki , Taketomi, Nobuo , Hatanaka, Kiyoyuki , Iriguchi, Shigeo
- 申请人： FUJITSU LIMITED
- 申请人地址： 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- 代理机构： Wilding, Frances Ward
- 优先权： JP2010079159 20100330
- 主分类号： H05K3/22
- IPC分类号： H05K3/22 ; H05K3/30 ; H05K3/34
摘要：
A printed circuit board includes a printed circuit board body and a resin layer. The printed circuit board body includes a plurality of mounting pads. The resin layer, containing a thermoplastic resin, is formed on the surface of the printed circuit board body. The resin layer includes a plurality of holes disposed to be aligned with the positions of the mounting pads on a one-to-one basis for exposing the mounting pads therethrough. In a method of fabricating the printed circuit board, the resin layer is formed atop the printed circuit board body.
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