A heat dissipating assembly includes a circuit board (1) having opposite first and second faces (11, 12). The circuit board (1) further includes a through-hole (13) extending from the first face (11) through the second face (12). A heat generating element (2) is mounted on the first face (11) of the circuit board (1) and electrically coupled to the circuit board (1). The heat generating element (2) includes a heat conducting portion (22) aligned with the through-hole (13). A heat dissipating unit (3) includes a base (31) having an engaging face (311) in contact with the second face (12) of the circuit board (1). A heat conducting adhesive (4) is filled in the through-hole (13). The heat conducting adhesive (4) is engaged with the engaging face (311) of the base (31) and the heat conducting portion (22) of the heat generating element (2). The heat generating element (2) is directly engaged with the heat dissipating unit (3) by the heat conducting adhesive (4) to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs.