The invention relates to a method for manufacturing a woodchip board (3) comprising a first (21) and second (23) woodchip layer sandwiching an intermediate layer (12) comprising woodchips of other chip size than the first (21) and second (23) woodchip layer. The method comprises the steps involving application of a first quantity (5) of glued woodchips (7) to a lower tool face (9) of a pressing tool (1, 31); application of a filler quantity (11) of glued woodchips (7') to the first quantity (5); application of a second quantity (13) of glued woodchips (7) to the filler quantity (11); compression of said quantities (5, 11, 13) by means of the lower (9) tool face and an upper tool face (15); realization of differentiated times when the glue of the glued woodchips (7) hardens in the first (5) and second quantity (13) respectively, by virtue of the production of these quantities with different thickness and/or by heating of the respective quantities (5, 13) to different temperatures; and removal of the hardened woodchip board (3) from the pressing tool (1, 31).