发明公开
- 专利标题： Coating and electronic component
- 专利标题（中）： Beschichtung und elektronisches Bauteil
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申请号： EP11169812.2申请日： 2011-06-14
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公开(公告)号： EP2410078A1公开(公告)日： 2012-01-25
- 发明人: Yoshida, Kenichi , Horikawa, Yuhei , Sato, Atsushi , Abe, Hisayuki
- 申请人： TDK Corporation
- 申请人地址： 1-13-1 Nihonbashi Chuo-ku Tokyo 103-8272 JP
- 专利权人： TDK Corporation
- 当前专利权人： TDK Corporation
- 当前专利权人地址： 1-13-1 Nihonbashi Chuo-ku Tokyo 103-8272 JP
- 代理机构： Grünecker, Kinkeldey, Stockmair & Schwanhäusser
- 优先权： JP2010163128 20100720
- 主分类号： C23C28/02
- IPC分类号： C23C28/02 ; H01L23/12
摘要：
The present invention provides a coating 10 provided on a conductor 20, the coating 10 has a first layer 12 containing palladium and a second layer 14 containing gold from the conductor 20 side, the first layer 12 has a first region 31 on the conductor 20 side and a second region 32 arranged nearer to the second layer 14 than the first region 31, and the second region 32 has a higher phosphorus concentration than the first region 31.
公开/授权文献
- EP2410078B1 Coating and electronic component 公开/授权日：2018-01-17
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