发明公开
- 专利标题： WIRE CONFIGURATION AND METHOD OF MAKING FOR AN IMPLANTABLE MEDICAL APPARATUS
- 专利标题（中）： 线配置和方法植入式医疗设备
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申请号： EP10709776.8申请日： 2010-03-15
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公开(公告)号： EP2416843A1公开(公告)日： 2012-02-15
- 发明人: WANG, Ling , LI, Bernard Q.
- 申请人： Medtronic, Inc
- 申请人地址： 710 Medtronic Parkway NE Minneapolis, MN 55432 US
- 专利权人： Medtronic, Inc
- 当前专利权人： Medtronic, Inc
- 当前专利权人地址： 710 Medtronic Parkway NE Minneapolis, MN 55432 US
- 代理机构： Hughes, Andrea Michelle
- 优先权： US419082 20090406
- 国际公布： WO2010117560 20101014
- 主分类号： A61N1/05
- IPC分类号： A61N1/05 ; H01B7/04 ; B21C37/04 ; A61N1/02
摘要：
A filar includes an inner conductive core that is formed of a low-resistivity material such as silver having a resistivity of less than 20μΩ per centimeter. A conductive coil is provided around the core to form a filar. This coil is formed of a biocompatible alloy or super alloy having an ultimate tensile strength (UTS) of between 150 kilo pounds per square inch (ksi) and 280 ksi at room temperature. Examples of such alloys include CoCrMo, CoFeCrMo, and CoFeNiCrMo. In one specific embodiment, the alloy is MP35N (CoNiCrMo), which may be low-titanium ("low-ti") MP35N. One or more such filars may be included within a wire. This wire may be carried by an implantable medical apparatus such as a lead, lead extension, or catheter. The wire may electrically couple elements such as connector electrodes to conducting electrodes or sensors.
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