A flexible emissive device, includes a flexible rough substrate having a rough substrate surface and defining a display area; an organic low-temperature adhesion layer formed on the rough substrate surface, at least a portion of the organic low-temperature adhesion layer having a thickness greater than or equal to five microns; a plurality of chiplets distributed in the display area and adhering to the organic low-temperature adhesion layer, each chiplet having one or more connection pads; a plurality of patterned bottom electrodes formed over the organic low-temperature adhesion layer in the display area, each bottom electrode being electrically connected to only one connection pad of a corresponding chiplet; one or more layers of light-emitting material formed over the bottom electrode; and a top electrode formed over the one or more layers of light-emitting material; and a flexible encapsulating layer located over the top electrode and adhered to the rough substrate surface.