The invention relates to a two part epoxy adhesive system, including: a composition (A) including 15 to 50% of a curable bisphenol A epoxy resin; 0.5 to 40% of an alkaline earth metal oxide or hydroxide; and 30 to 80% of an inert filler; and a composition (B) including: 15 to 50% of a polymercaptan obtained by the esterification of mercaptoacetic or mercaptopropionic acid with a polyol including 3 to 6 carbon atoms, and/or a polymercaptan obtained by the effect of hydrogen sulfide on a polyoxyalkylene polyglycidyl ether; and 50 to 85% of an inert filler. The weight ratio of composition (A)/composition (B) of said system corresponding to an epoxy group mole number/mercaptan group mole number ratio is between 0.95 and 2.5. The invention also relates to the use of said system as a glue for attachment or repair.