发明公开
EP2458689A1 Socket for connection between a package and an electronic circuit board
有权
Buchsefürden Anschluss zwischen einer IC-Packung und einer Leiterplatte
- 专利标题： Socket for connection between a package and an electronic circuit board
- 专利标题（中）： Buchsefürden Anschluss zwischen einer IC-Packung und einer Leiterplatte
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申请号： EP11181575.9申请日： 2011-09-16
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公开(公告)号： EP2458689A1公开(公告)日： 2012-05-30
- 发明人: Masuda, Yasushi , Tamura, Akira , Osawa, Satoshi
- 申请人： FUJITSU LIMITED
- 申请人地址： 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： 1-1, Kamikodanaka 4-chome, Nakahara-ku Kawasaki-shi, Kanagawa 211-8588 JP
- 代理机构： HOFFMANN EITLE
- 优先权： JP2010260918 20101124
- 主分类号： H01R12/91
- IPC分类号： H01R12/91 ; H01R12/70 ; H05K7/10
摘要：
A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.
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