A low temperature curable epoxy resin composition which comprises: an epoxy component that contains an epoxy compound having per molecule at least two epoxy groups and that is liquid at 25°C; an aromatic amine based curing agent that contains an aromatic amine compound having per molecule at least two amino groups directly bonded to the aromatic ring and that is liquid at 25°C; andMg(II) acetylacetonate as a cure accelerator. The composition, which contains a novel cure accelerator using a metal complex, exhibits high stability at room temperature while lowering a cure temperature or shortening a cure time.