发明公开
- 专利标题： Encapsulating sheet and optical semiconductor element device
- 专利标题（中）： 封装膜和半导体部件装置
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申请号： EP12171629.4申请日： 2012-06-12
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公开(公告)号： EP2535955A3公开(公告)日： 2014-03-12
- 发明人: Matsuda, Hirokazu , Kondo, Takashi , Kono, Hiroki
- 申请人： NITTO DENKO CORPORATION
- 申请人地址： 1-2, Shimo-hozumi 1-chome Ibaraki-shi, Osaka 567-8680 JP
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： 1-2, Shimo-hozumi 1-chome Ibaraki-shi, Osaka 567-8680 JP
- 代理机构： HOFFMANN EITLE
- 优先权： JP2011132275 20110614; JP2011228921 20111018
- 主分类号： H01L33/56
- IPC分类号： H01L33/56 ; C08L83/04 ; C08J5/18 ; H01L33/50 ; H01L33/54
摘要：
An encapsulating sheet (1) includes an encapsulating resin layer (7) and a wavelength conversion layer (8) laminated on the encapsulating resin layer. The wavelength conversion layer is formed by laminating a barrier layer (6) formed of a light transmissive resin composition and having a thickness of 200 µm to 1000 µm, and a phosphor layer (5) containing a phosphor.
公开/授权文献
- EP2535955A2 Encapsulating sheet and optical semiconductor element device 公开/授权日：2012-12-19
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