发明公开
EP2573807A1 Semiconductor structure and process for bird's beak reduction 审中-公开
Halbleiterstruktur und Verfahren zur Vogelkopfreduzierung

  • 专利标题: Semiconductor structure and process for bird's beak reduction
  • 专利标题(中): Halbleiterstruktur und Verfahren zur Vogelkopfreduzierung
  • 申请号: EP11290430.5
    申请日: 2011-09-23
  • 公开(公告)号: EP2573807A1
    公开(公告)日: 2013-03-27
  • 发明人: Bourdelle, Konstantin
  • 申请人: Soitec
  • 申请人地址: Chemin des Franques Parc Technologique des Fontaines 38190 Bernin FR
  • 专利权人: Soitec
  • 当前专利权人: Soitec
  • 当前专利权人地址: Chemin des Franques Parc Technologique des Fontaines 38190 Bernin FR
  • 代理机构: Grünecker, Kinkeldey, Stockmair & Schwanhäusser
  • 主分类号: H01L21/762
  • IPC分类号: H01L21/762
Semiconductor structure and process for bird's beak reduction
摘要:
The present invention relates to a semiconductor structure including a bulk semiconductor; a thin semiconductor layer; an insulating layer between the bulk semiconductor and the thin semiconductor layer; a trench; and a side wall doped region, on at least a region of the inner surface of the trench.
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