发明公开
EP2581414A1 Polyamide resin molding material and laminate using the same
有权
Formmaterial aus Polyamidharz und Laminat damit
- 专利标题： Polyamide resin molding material and laminate using the same
- 专利标题（中）： Formmaterial aus Polyamidharz und Laminat damit
-
申请号： EP13150458.1申请日： 2009-01-05
-
公开(公告)号： EP2581414A1公开(公告)日： 2013-04-17
- 发明人: Kubo, Tsuyoshi , Enomoto, Tatsuya , Yamasaki, Kouji
- 申请人： Ube Industries, Ltd.
- 申请人地址： 1978-96, Oaza Kogushi Ube-shi Yamaguchi 755-8633 JP
- 专利权人： Ube Industries, Ltd.
- 当前专利权人： Ube Industries, Ltd.
- 当前专利权人地址： 1978-96, Oaza Kogushi Ube-shi Yamaguchi 755-8633 JP
- 代理机构： Gille Hrabal
- 优先权： JP2008003210 20080110
- 主分类号： C08L77/00
- IPC分类号： C08L77/00 ; B32B27/34 ; B32B27/40 ; C08K5/134 ; C08K5/435 ; C08K5/10 ; B32B27/08
摘要：
A polyamide resin molding material having excellent thermal weldability to thermoplastic polyurethane molded articles, which is a polyamide resin molding material including from 5 to 40 parts by mass of a specified aromatic compound (B) based on 100 parts by mass of a polyamide resin (A) having a (terminal amino group/terminal carboxyl group) molar ratio of more than 1; and a laminate using the same are disclosed.
公开/授权文献
- EP2581414B1 Polyamide resin molding material and laminate using the same 公开/授权日：2016-06-22
信息查询
