发明公开
- 专利标题: Credential manufacturing device substrate shuttle
- 专利标题(中): 保护衬底可允许的制造装置
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申请号: EP12191115.0申请日: 2012-11-02
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公开(公告)号: EP2592030A3公开(公告)日: 2014-07-02
- 发明人: Hoffman, Ted , Umberger, Philip
- 申请人: HID Global Corporation
- 申请人地址: 15370 Barranca Parkway Irvine CA 92618-2215 US
- 专利权人: HID Global Corporation
- 当前专利权人: HID Global Corporation
- 当前专利权人地址: 15370 Barranca Parkway Irvine CA 92618-2215 US
- 代理机构: Grosfillier, Philippe
- 优先权: US201113293595 20111110
- 主分类号: B65H5/04
- IPC分类号: B65H5/04 ; B65H15/00 ; B65H3/44
摘要:
One embodiment of a credential manufacturing device (100) comprises a first hopper (110), a first processing path (124), a first processing device (112), a substrate shuttle (120) and a shuttle drive (130). The first hopper (110) is configured to contain a plurality of card substrates (122) and includes an output port through which individual card substrates are discharged. The first processing device (112) is in the first processing path (124) and is configured to perform a first process on individual card substrates in the first processing path. The substrate shuttle (120) is positioned between the first hopper (110) and the first processing path (124) and is configured to move relative to the first hopper and the first processing path along a horizontal shuttle path (126) that is transverse to the first processing path. The shuttle (120) is configured to receive individual card substrates from the output port of the first hopper (110), transport received card substrates along the shuttle path (126), and deliver received card substrates to the first processing path (124). The shuttle drive (130) is configured to drive movement of the substrate shuttle (120) along the shuttle path (124).
公开/授权文献
- EP2592030B1 Credential manufacturing device substrate shuttle 公开/授权日:2015-09-16
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