An infrared camera architecture includes, for an embodiment, an infrared detector, a substrate, a plurality of electrical components coupled to the substrate, and a pedestal made of a thermally conductive material and having a leg coupled to the substrate. The infrared detector is supported by and thermally coupled to the pedestal, with the pedestal thermally isolating the infrared detector from the plurality of electrical components. The infrared detector may include a substrate having an array of infrared detectors and a readout integrated circuit interconnected with the array disposed on an upper surface thereof, with a generally planar window spaced above the array and a mesa bonded to the window. The mesa may define a closed cavity between the window and the array that encloses the array such that a solder seal bonds the mesa to the substrate so as to seal the cavity.