发明公开
EP2600424A1 Solar modules containing a backsheet with a polyolefin bonding layer 审中-公开
太阳能模块包含一个带有聚烯烃粘合层的背板

Solar modules containing a backsheet with a polyolefin bonding layer
摘要:
Method for mounting a solar module (1) on an aluminium containing support structure (2) comprising
i) providing a solar module (1) comprising in order of position from the front, i.e. the light-receiving side, to the back:
(a) a top part (40) comprising a top layer (11) and a solar cell layer (12) and
(b) a bottom part (41) comprising a multi-layer backsheet (13) having at least one bonding layer (14) wherein the backsheet (13) has a top surface (131) contacting the solar cell layer (12), which preferably is fully encapsulated, and opposite thereto a rear surface (111) exposed to the outside of the solar module, wherein the bonding layer (14) forms at least a part of the rear surface (111) and comprises a polyolefin sheet (114) containing as its major component a cross-linked polymer selected from polyethene homo polymers, polypropene homopolymers, polyethene copolymers comprising repeating units derived from ethene and one or more α-olefinic hydrocarbons, polypropene copolymers comprising repeating units derived from propene and one or more α-olefinic hydrocarbons and combinations thereof;

ii) laminating the bonding layer (14) to the support structure (2).
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L31/00 对红外辐射、光、较短波长的电磁辐射,或微粒辐射敏感的,并且专门适用于把这样的辐射能转换为电能的,或者专门适用于通过这样的辐射进行电能控制的半导体器件;专门适用于制造或处理这些半导体器件或其部件的方法或设备;其零部件(H01L51/42优先;由形成在一共用衬底内或其上的多个固态组件,而不是辐射敏感元件与一个或多个电光源的结合所组成的器件入H01L27/00)
H01L31/04 .用作光伏〔PV〕转换器件(制造中其测试入H01L21/66;制造之后其测试入H02S50/10)
H01L31/042 ..单个光伏电池的光伏模块或者阵列(用于光伏模块的支撑结构入H02S20/00)
H01L31/048 ...模块的封装
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