发明公开
- 专利标题: CONDUCTIVE PATH STRUCTURE AND WIRE HARNESS
- 专利标题(中): 结构电气通路及线束
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申请号: EP11770186.2申请日: 2011-09-16
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公开(公告)号: EP2617041A1公开(公告)日: 2013-07-24
- 发明人: ADACHI, Hideomi , KUBOSHIMA, Hidehiko
- 申请人: Yazaki Corporation
- 申请人地址: 4-28, Mita 1-chome Minato-ku Tokyo 108-8333 JP
- 专利权人: Yazaki Corporation
- 当前专利权人: Yazaki Corporation
- 当前专利权人地址: 4-28, Mita 1-chome Minato-ku Tokyo 108-8333 JP
- 代理机构: Grünecker, Kinkeldey, Stockmair & Schwanhäusser
- 优先权: JP2010207548 20100916
- 国际公布: WO2012036321 20120322
- 主分类号: H01B7/32
- IPC分类号: H01B7/32 ; B60K28/14
摘要:
A conductive path structure includes a conductor (28) that includes a first conductive portion and a second conductive portion which are connected to each other through a cut-off facilitating portion ( 30 ), and a semi -solid state insulation member ( 31 ) that is in a semi -solid state and covers the cut-off facilitating portion ( 30 ). When the cut-off facilitating portion ( 30 ) is cut off so as to separate the first conductive portion and the second conductive portion to each other due to an impact applied to the cut-off facilitating portion ( 30 ), the semi -solid state insulation member ( 31 ) covers end portions of the separated first conductive portion and the separated second conductive portion which are close to the cut-out facilitating portion ( 30 ).
公开/授权文献
- EP2617041B1 CONDUCTIVE PATH STRUCTURE AND WIRE HARNESS 公开/授权日:2015-02-25
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