发明公开
- 专利标题: STRUCTURE TO REDUCE ELECTROPLATED STABILIZER CONTENT
- 专利标题(中): 减少电镀稳定剂含量的结构
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申请号: EP11825858.1申请日: 2011-09-14
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公开(公告)号: EP2617042A1公开(公告)日: 2013-07-24
- 发明人: XIE, Yi-Yuan , LENSETH, Kenneth, P. , WATERMAN, Justin , SELVAMANICKAM, Venkat
- 申请人: Superpower, Inc.
- 申请人地址: 450 Duane Avenue Schenectady, NY 12304 US
- 专利权人: Superpower, Inc.
- 当前专利权人: Superpower, Inc.
- 当前专利权人地址: 450 Duane Avenue Schenectady, NY 12304 US
- 代理机构: Zimmermann & Partner
- 优先权: US882654 20100915
- 国际公布: WO2012037231 20120322
- 主分类号: H01B12/06
- IPC分类号: H01B12/06 ; H01B12/10
摘要:
A superconducting article includes first and second stacked conductor segments. The first stacked conductor segment includes first and second superconductive segments and has a nominal thickness tn1. The second stacked conductor segment includes third and forth superconductive segments and has a nominal thickness tn2. The superconducting article further includes a joint region comprising a first splice connecting the first and third superconductive segments together and a second splice connecting the second and forth superconductive segments together. The first splice is adjacent to and bridged portions of the first and third superconductive segments along at least a portion of the joint region, and the second splice is adjacent to and bridged portions of the second and forth superconductive segments along at least a portion of the joint region. The joint region has a thickness tjr, wherein tjr is not greater than at least one of 1.8tn1 and 1.8tn2.
公开/授权文献
- EP2617042B1 STRUCTURE FOR JOINING SUPERCONDUCTORS 公开/授权日:2018-08-08
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