发明公开
- 专利标题: STRUCTURE TO REDUCE ELECTROPLATED STABILIZER CONTENT
- 专利标题(中): 用于连接电流有效导体的结构
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申请号: EP11825858申请日: 2011-09-14
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公开(公告)号: EP2617042A4公开(公告)日: 2015-09-16
- 发明人: XIE YI-YUAN , LENSETH KENNETH P , WATERMAN JUSTIN , SELVAMANICKAM VENKAT
- 申请人: SUPERPOWER INC
- 专利权人: SUPERPOWER INC
- 当前专利权人: SUPERPOWER INC
- 优先权: US88265410 2010-09-15
- 主分类号: H01B12/06
- IPC分类号: H01B12/06 ; H01B12/10
摘要:
A superconducting article includes first and second stacked conductor segments. The first stacked conductor segment includes first and second superconductive segments and has a nominal thickness tn1. The second stacked conductor segment includes third and forth superconductive segments and has a nominal thickness tn2. The superconducting article further includes a joint region comprising a first splice connecting the first and third superconductive segments together and a second splice connecting the second and forth superconductive segments together. The first splice is adjacent to and bridged portions of the first and third superconductive segments along at least a portion of the joint region, and the second splice is adjacent to and bridged portions of the second and forth superconductive segments along at least a portion of the joint region. The joint region has a thickness tjr, wherein tjr is not greater than at least one of 1.8tn1 and 1.8tn2.
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