An electrodeless plasma lamp is provided. The lamp includes a conductive enclosure including a dielectric material (e.g., air) and a bulb containing a fill to form a light emitting plasma. A radio frequency (RF) power source is coupled into the enclosure. At least one conductive applicator applies power from the enclosure to the bulb and at least one lumped inductive element is coupled between the RF feed and applicator. The lumped inductive element may be a helically wound coil. In an example embodiment, the lamp includes first and second lumped inductive elements. The first and second lumped inductive elements may extend from opposed end walls of the enclosure. The first lumped inductive element may be connected to a first conductive applicator located proximate a first end of the bulb and the second lumped inductive element may be connected to a second conductive applicator located proximate a second end of the bulb.