发明公开
EP2623433A1 COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
审中-公开
ABDECKBAND ZUM VERPACKEN VON ELEKTRONIKKOMPONENTEN
- 专利标题： COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
- 专利标题（中）： ABDECKBAND ZUM VERPACKEN VON ELEKTRONIKKOMPONENTEN
-
申请号： EP11829161.6申请日： 2011-09-28
-
公开(公告)号： EP2623433A1公开(公告)日： 2013-08-07
- 发明人: MASUI Ken , HIRAMATSU Masayuki
- 申请人： Sumitomo Bakelite Co., Ltd.
- 申请人地址： 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 JP
- 专利权人： Sumitomo Bakelite Co., Ltd.
- 当前专利权人： Sumitomo Bakelite Co., Ltd.
- 当前专利权人地址： 5-8 Higashi-Shinagawa 2-chome Shinagawa-ku Tokyo 140-0002 JP
- 代理机构： Ilgart, Jean-Christophe
- 优先权： JP2011072187 20110329; JP2010221536 20100930
- 国际公布： WO2012043608 20120405
- 主分类号： B65D73/02
- IPC分类号： B65D73/02 ; B32B27/00 ; B65D85/86
摘要：
According to the present invention, a cover tape for electronic component packaging is provided which has suitable transparency, and which enables suppression of the charge that occurs during peeling from carrier tape. The cover tape for electronic component packaging of the present invention is provided with a heat sealant layer on top of the base layer, and the aforementioned heat sealant layer contains polyolefin resin and polyether-polyolefin copolymer. The weight ratio of the polyether-polyolefin copolymer in the aforementioned heat sealant layer is 10 weight % or more and 70 weight % or less.
信息查询
