发明公开
EP2625710A1 DISPOSITIF POUR LA DISSIPATION THERMIQUE DESTINE A AU MOINS UN COMPOSANT ELECTRONIQUE ET PROCEDE CORRESPONDANT
审中-公开
KÜHLKÖRPERFÜRMINDESTENS EIN ELEKTRONISCHES BAUTEIL UND ENTSPRECHENDES VERFAHREN
- 专利标题： DISPOSITIF POUR LA DISSIPATION THERMIQUE DESTINE A AU MOINS UN COMPOSANT ELECTRONIQUE ET PROCEDE CORRESPONDANT
- 专利标题（英）： Heat-sink device intended for at least one electronic component and corresponding method
- 专利标题（中）： KÜHLKÖRPERFÜRMINDESTENS EIN ELEKTRONISCHES BAUTEIL UND ENTSPRECHENDES VERFAHREN
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申请号： EP11773882.3申请日： 2011-09-27
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公开(公告)号： EP2625710A1公开(公告)日： 2013-08-14
- 发明人: GASSE, Adrien , REVIRAND, Pascal
- 申请人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 申请人地址： 25, rue Leblanc Bâtiment "Le Ponant D" 75015 Paris FR
- 专利权人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 当前专利权人： Commissariat à l'Énergie Atomique et aux Énergies Alternatives
- 当前专利权人地址： 25, rue Leblanc Bâtiment "Le Ponant D" 75015 Paris FR
- 代理机构： Corret, Hélène
- 优先权： FR1003931 20101005
- 国际公布： WO2012046161 20120412
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/367 ; H01L23/373
摘要：
The present invention relates to a heat-sink device intended for at least one electronic component (12), including: heat-sink means; a substrate (11) for the at least one electronic component (12), said substrate covering the heat-sink means; and thermal coupling means provided between the substrate and the heat-sink means and made from a material different from that of the heat-sink means. According to the invention, the heat-sink means consist of a set of independent fins (10), and the thermal-coupling means (13) are made from a heat-conductive polymer material and also serve as mechanical coupling means between the substrate (11) and the fins (10).
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