发明公开
EP2625942A2 METHOD AND APPARATUS FOR PROVIDING REINFORCED COMPOSITE MATERIALS WITH EMI SHIELDING 审中-公开
方法和一种用于提供强化复合材料与EMC SHIELD

  • 专利标题: METHOD AND APPARATUS FOR PROVIDING REINFORCED COMPOSITE MATERIALS WITH EMI SHIELDING
  • 专利标题(中): 方法和一种用于提供强化复合材料与EMC SHIELD
  • 申请号: EP11831585.2
    申请日: 2011-10-06
  • 公开(公告)号: EP2625942A2
    公开(公告)日: 2013-08-14
  • 发明人: WENZEL, Edward J.
  • 申请人: Inteva Products LLC
  • 申请人地址: 1401 Crooks Road Troy, Michigan 48084 US
  • 专利权人: Inteva Products LLC
  • 当前专利权人: Inteva Products LLC
  • 当前专利权人地址: 1401 Crooks Road Troy, Michigan 48084 US
  • 代理机构: Prinz & Partner
  • 优先权: US390410P 20101006
  • 国际公布: WO2012048097 20120412
  • 主分类号: H05K9/00
  • IPC分类号: H05K9/00 B29C43/18
METHOD AND APPARATUS FOR PROVIDING REINFORCED COMPOSITE MATERIALS WITH EMI SHIELDING
摘要:
A method of forming an item with electromagnetic interference shielding, the method including the steps of: inserting a first polymer into a first compounding extruder, wherein the first compounding extruder provides a first melted charge; inserting the first melted charge into a second compounding extruder, wherein the second compounding extruder introduces a plurality of conductive fibers into the first melted charge and wherein the second compounding extruder provides a second melted charge comprising the first melted charge and a plurality of conductive fibers; depositing the second melted charge onto a least one die of a compression mold; and closing the compression mold about the second melted charge in order to form the item.
信息查询
0/0