发明公开
- 专利标题: MOLDED POLYAMIDE RESIN ARTICLE
- 专利标题(中): 环状尼龙树脂制品
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申请号: EP11830561申请日: 2011-09-29
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公开(公告)号: EP2626377A4公开(公告)日: 2014-05-07
- 发明人: MITADERA JUN , KUROKAWA MASASHI , TAKANO TAKAHIRO
- 申请人: MITSUBISHI GAS CHEMICAL CO
- 专利权人: MITSUBISHI GAS CHEMICAL CO
- 当前专利权人: MITSUBISHI GAS CHEMICAL CO
- 优先权: JP2010228509 2010-10-08
- 主分类号: C08G69/26
- IPC分类号: C08G69/26 ; C08K5/29 ; C08L77/06
摘要:
Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50 % and a moisture content of 0.1 to 2 % by mass.
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