发明公开
EP2627803A1 HETEROGROWTH 有权
HETEROWACHSTUM

HETEROGROWTH
摘要:
A method comprises bonding a silicon wafer (13) or silicon-on-insulator wafer having a monocrystalline silicon surface region (15) and a wafer-like carrier (12) comprising silicon carbide so as to form a composite wafer (18) having a surface with the monocrystalline silicon surface region for silicon carbide heterogrowth, such as heteroepitaxy. The composite wafer can help avoid wafer bow.
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